e-MMC

e-MMC

  • 东芝eMMC

e-MMC是指一系列具有ECC、耗损均衡和坏块管理等控制功能的NAND闪存(NAND)。e-MMC也提供符合JEDEC/MMCA版本 4.5/5.0/5.1的高速存储卡接口,从而消除了用户对于直接控制NAND的需求。所以,e-MMC可轻松用作嵌入式多媒体卡(MMC)存储器。

容量器件型号Classe-MMC
版本
最大数据速率
(MB/s)
电源电压工作
温度(°C)
封装
Vcc(V)VccQ(V)尺寸(mm)代码
4 GbytesTHGBMNG5D1LBAITConsumer5.04002.7 to 3.61.70 to 1.95,
2.7 to 3.6
-25 to 8511×10×0.8P-WFBGA153-1110-0.50
THGBMNG5D1LBAILConsumer5.04002.7 to 3.61.70 to 1.95, 2.7 to 3.6-25 to 8511.5×13×0.8P-WFBGA153-1113-0.50
8 GbytesTHGBMHG6C1LBAILConsumer5.14002.7 to 3.61.70 to 1.95, 2.7 to 3.6-25 to 8511.5×13×0.8P-WFBGA153-1113-0.50
THGBMHG6C1LBAU6Industrial5.14002.7 to 3.61.70 to 1.95, 2.7 to 3.6-40 to 105 (1)11.5×13×0.8P-WFBGA153-1113-0.50
16 GbytesTHGBMHG7C1LBAILConsumer5.14002.7 to 3.61.70 to 1.95, 2.7 to 3.6-25 to 8511.5×13×0.8P-WFBGA153-1113-0.50
THGBMHG7C2LBAU7Industrial5.14002.7 to 3.61.70 to 1.95, 2.7 to 3.6-40 to 105 (1)11.5×13×1.0P-VFBGA153-1113-0.50
32 GbytesTHGBMHG8C2LBAILConsumer5.14002.7 to 3.61.70 to 1.95, 2.7 to 3.6-25 to 8511.5×13×0.8P-WFBGA153-1113-0.50
THGBMHG8C4LBAU7Industrial5.14002.7 to 3.61.70 to 1.95, 2.7 to 3.6-40 to 105 (1)11.5×13×1.0P-VFBGA153-1113-0.50
64 GbytesTHGBMHG9C4LBAIRConsumer5.14002.7 to 3.61.70 to 1.95, 2.7 to 3.6-25 to 8511.5×13×1.0P-VFBGA153-1113-0.50
THGBMHG9C8LBAU8Industrial5.14002.7 to 3.61.70 to 1.95, 2.7 to 3.6-40 to 105 (1)11.5×13×1.2P-TFBGA153-1113-0.50
128 GbytesTHGBMHT0C8LBAIGConsumer5.14002.7 to 3.61.70 to 1.95, 2.7 to 3.6-25 to 8511.5×13×1.2P-TFBGA153-1113-0.50
  • 注解 (1):Tc=115°C(最大值)。
  • Contact the Toshiba sales representative for sample schedule about products under development.
  • Details about your intended usage would be checked before submitting samples of the Industrial class product.

  • 金士顿eMMC
Kingston eMMC

金士顿eMMC™ 是嵌入式、非易失存储器系统,由闪存和闪存控制器构成,这不仅简化了应用程序接口设计,还免去了主机处理器的低级闪存管理任务。eMMC 是智能手机、平板电脑和移动互联网设备等众多消费类电子设备的主流存储组件。它越来越多地被应用于众多工业和嵌入式应用领域。

对于开发者而言,eMMC 简化了接口设计和验证流程,从而减少了产品上市时间并促进了对未来闪存设备产品的支持。

小的 BGA 封装尺寸和低功耗让 eMMC 成为移动产品和嵌入式产品的可行低成本存储器。为了更好地满足多空间受限和物联网应用的要求,金士顿发布了采用标准 JEDEC 的世界最小尺寸的 eMMC 封装。 。eMMC 技术规范由微电子工业开放标准制定全球领导者 JEDEC 管理。

金士顿 I-Temp eMMC

金士顿的工业温度 eMMC 产品符合最新 JEDEC eMMC 标准,并兼容以往 eMMC 标准。它拥有标准 eMMC 的所有优势,并且设备的工作温度范围符合工业工作温度要求 (-40°C~85°C),使其非常适合用作恶劣户外环境和汽车应用的存储解决方案。

eMMC 产品型号和规格
产品料号容量eMMC 标准封装尺寸NAND
EMMC04G-M6274GB5.0/5.1 (HS400)11.5x13x1.0MLC
EMMC04G-M6574GB5.0/5.1 (HS400)9.0×7.5×0.8MLC
EMMC08G-M3258GB5.0/5.1 (HS400)11.5x13x1.0MLC
EMMC16G-TB2916GB5.1 (HS400)11.5x13x0.83D TLC BiCS3
EMMC32G-TB2932GB5.1 (HS400)11.5x13x0.83D TLC BiCS3
EMMC32G-TA2932GB5.1 (HS400)11.5x13x0.83D TLC BiCS3
EMMC64G-TA2964GB5.1 (HS400)11.5x13x0.83D TLC BiCS3
EMMC128-TA29128GB5.1 (HS400)11.5x13x1.03D TLC BiCS3

eMMC 产品宣传册 PDFiTemp eMMC 产品宣传册 PDF请求信息

金士顿eMMC 适配器

对于尚无 eMMC 插槽布局的设计,这些 eMMC 转 SD/MMC 适配器可以让用户通过 SD/MMC 插槽来测试 eMMC,而无需更改 PCB 布局。

eMMC 适配器产品型号
产品料号说明
EMMC04G-M627-ADP4GB eMMC 适配器
EMMC08G-M325-ADP8GB eMMC 适配器
EMMC16G-M525-ADP16GB eMMC 适配器
EMMC32G-M525-ADP32GB eMMC 适配器
EMMC64G-M525-ADP64GB eMMC 适配器

三星eMMC

Product Selector

VersionDensityVoltageInterfacePackage SizeTemp.
eMMC 5.1eMMC 5.0256GB128GB64GB32GB16GB8GB4GB1.8 / 3.3 V1.8, 3.3 V / 3.3 VHS40011.5 x 13 x 1.2 mm11.5 x 13 x 1.0 mm11.5 x 13 x 0.8 mm11 x 10 x 0.8 mm-40 ~ 85 °C-40 ~ 105 °C-25 ~ 85 °C
Part NumberVersionDensityVoltageInterfacePackage SizeTemp.
KLM4G1FETE-B041eMMC 5.14GB1.8, 3.3 V / 3.3 VHS40011 x 10 x 0.8 mm-25 ~ 85 °C
KLM8G1GESD-B03PeMMC 5.08GB1.8 / 3.3 VHS40011.5 x 13 x 0.8 mm-40 ~ 85 °C
KLM8G1GESD-B03QeMMC 5.08GB1.8 / 3.3 VHS40011.5 x 13 x 0.8 mm-40 ~ 105 °C
KLM8G1GESD-B04PeMMC 5.18GB1.8 / 3.3 VHS40011.5 x 13 x 0.8 mm-40 ~ 85 °C
KLM8G1GESD-B04QeMMC 5.18GB1.8 / 3.3 VHS40011.5 x 13 x 0.8 mm-40 ~ 105 °C
KLM8G1GETF-B041eMMC 5.18GB1.8, 3.3 V / 3.3 VHS40011.5 x 13 x 0.8 mm-25 ~ 85 °C
KLM8G1GEUF-B04PeMMC 5.18GB1.8 / 3.3 VHS40011.5 x 13 x 0.8 mm-40 ~ 85 °C
KLM8G1GEUF-B04QeMMC 5.18GB1.8 / 3.3 VHS40011.5 x 13 x 0.8 mm-40 ~ 105 °C
KLMAG1JETD-B041eMMC 5.116GB1.8, 3.3 V / 3.3 VHS40011.5 x 13 x 0.8 mm-25 ~ 85 °C
KLMAG2GESD-B03PeMMC 5.016GB1.8 / 3.3 VHS40011.5 x 13 x 0.8 mm-40 ~ 85 °C
  • 美光eMMC

e.MMC Part Catalog

  • 2GB
Part No. (1)

MTFC2GMDEA-0M WT2GBProductionWFBGA3.3V4.41-25C to +85C

  • 4GB
Part No. (10)

MTFC4GACAAAM-1M WT4GBProductionVFBGA2.7V-3.6V4.5-25C to +85C

MTFC4GACAAAM-4M IT4GBEnd of LifeVFBGA2.7V-3.6V4.5-40C to +85C

MTFC4GACAANA-4M IT4GBProductionTBGA2.7V-3.6V4.5-40C to +85C

MTFC4GLGDM-AIT Z4GBProductionTFBGA2.7V-3.6V4.4-40C to +85C

MTFC4GLGDQ-AIT Z4GBProductionLBGA2.7V-3.6V4.4-40C to +85C

MTFC4GMTEA-WT4GBObsoleteWFBGA2.7V-3.6V4.41-25C to +85C

MTFC4GMWDM-3M AIT4GBProductionTFBGA2.7V-3.6V4.5-40C to +85C

MTFC4GMWDM-3M AIT A4GBProductionTFBGA2.7V-3.6V-40°C to +85°C

MTFC4GMWDQ-3M AIT4GBProductionLBGA2.7V-3.6V4.5-40C to +85C

MTFC4GMXEA-WT4GBObsoleteWFBGA2.7V-3.6V-25C to +85C

  • 8GB
Part No. (18)

MTFC8GACAAAM-1M WT8GBEnd of LifeVFBGA2.7V-3.6V4.5-25C to +85C

MTFC8GACAAAM-4M IT8GBEnd of LifeVFBGA2.7V-3.6V4.5-40C to +85C

MTFC8GACAANA-4M IT8GBProductionTBGA2.7V-3.6V4.5-40C to +85C

MTFC8GAKAJCN-1M WT8GBProductionVFBGA3.3V5.0-25C to +85C

MTFC8GAKAJCN-4M IT8GBProductionVFBGA3.3V5.0-40C to +85C

MTFC8GLDDQ-4M IT8GBEnd of LifeLBGA3.3V4.41-40C to +85C

MTFC8GLDEA-4M IT8GBEnd of LifeWFBGA3.3V4.41-40C to +85C

MTFC8GLGDM-AIT Z8GBProductionTFBGA2.7V-3.6V4.4-40C to +85C

MTFC8GLGDQ-AIT Z8GBProductionLBGA2.7V-3.6V4.4-40C to +85C

MTFC8GLSEA-IT8GBObsoleteWFBGA2.7V-3.6V4.41-25C to +85C

MTFC8GLTEA-WT8GBObsoleteWFBGA2.7V-3.6V4.41-25C to +85C

MTFC8GLWDM-3M AIT Z8GBContact FactoryTFBGA2.7V-3.6V4.5-40C to +85C

MTFC8GLWDM-AIT A8GBProductionTFBGA2.7V-3.6V-40C to +85C

MTFC8GLWDM-AIT Z8GBProductionTFBGA2.7V-3.6V4.5-40C to +85C

MTFC8GLWDQ-3M AIT Z8GBProductionLFBGA2.7V-3.6V4.5-40C to +85C

MTFC8GLXEA-WT8GBObsoleteWFBGA2.7V-3.6V-25C to +85C

N2M400GDB321A3CE8GBObsoleteLBGA3.3V4.41-40C to +85C

N2M400GDB321A3CF8GBObsoleteLBGA3.3V4.41-40C to +85C

  • 16GB
Part No. (20)

MTFC16GAKAECN-2M WT16GBEnd of LifeVFBGA3.3V5.0-25C to +85C

MTFC16GAKAECN-4M IT16GBEnd of LifeVFBGA3.3V5.0-40C to +85C

MTFC16GAKAEDQ-AIT16GBProductionLFBGA3.3V5.0-40C to +85C

MTFC16GAKAENA-4M IT16GBProductionTBGA3.3V5.0-40C to +85C

MTFC16GJDDQ-4M IT16GBObsoleteLBGA3.3V4.41-40C to +85C

MTFC16GJDEC-2M WT16GBObsoleteWFBGA3.3V4.41-25C to +85C

MTFC16GJDEC-4M IT16GBEnd of LifeWFBGA3.3V4.41-40C to +85C

MTFC16GJGDQ-AIT Z16GBProductionLBGA2.7V-3.6V4.4-40C to +85C

MTFC16GJGEF-AIT Z16GBContact FactoryTFBGA2.7V-3.6V4.4-40C to +85C

MTFC16GJSEC-IT16GBObsoleteWFBGA2.7V-3.6V4.41-40C to +85C

MTFC16GJVEC-2M WT16GBObsoleteWFBGA3.3V4.41-25C to +85C

MTFC16GJVEC-4M IT16GBObsoleteWFBGA3.3V4.41-40C to +85C

MTFC16GLTAM-WT16GBObsoleteVFBGA2.7V-3.6V4.41-25C to +85C

MTFC16GLTDV-WT16GBObsoleteVFBGA2.7V-3.6V4.41-25C to +85C

MTFC16GLWDM-4M AIT Z16GBProductionTFBGA2.7V-3.6V4.5-40C to +85C

MTFC16GLWDQ-4M AIT Z16GBProductionLFBGA2.7V-3.6V4.5-40C to +85C

MTFC16GLXAM-WT16GBObsoleteVFBGA2.7V-3.6V-25C to +85C

MTFC16GLXDV-WT16GBObsoleteVFBGA2.7V-3.6V-25C to +85C

N2M400HDB321A3CE16GBObsoleteLBGA3.3V4.41-40C to +85C

N2M400HDB321A3CF16GBObsoleteLBGA3.3V4.41-40C to +85C

  • 32GB
Part No. (21)

MTFC2GMDEA-0M WT2GBProductionWFBGA3.3V4.41-25C to +85C

MTFC32GAKAECN-3M WT32GBEnd of LifeVFBGA3.3V5.0-25C to +85C

MTFC32GAKAECN-4M IT32GBEnd of LifeVFBGA3.3V5.0-40C to +85C

MTFC32GAKAEDQ-AIT32GBProductionLFBGA3.3V5.0-40C to +85C

MTFC32GAKAENA-4M IT32GBProductionTBGA3.3V5.0-40C to +85C

MTFC32GAMAKAM-WT32GBProductionVFBGA3.3V-25C to +85C

MTFC32GJDDQ-4M IT32GBEnd of LifeLBGA3.3V4.41-40C to +85C

MTFC32GJDED-3M WT32GBObsoleteWFBGA3.3V4.41-25C to +85C

MTFC32GJGDQ-AIT Z32GBProductionLBGA2.7V-3.6V-40C to +85C

MTFC32GJGEF-AIT Z32GBProductionTFBGA2.7V-3.6V4.4-40C to +85C

MTFC32GJTED-WT32GBObsoleteVFBGA2.7V-3.6V4.41-25C to +85C

MTFC32GJVED-3M WT32GBObsoleteVFBGA3.3V4.41-25C to +85C

MTFC32GJVED-4M IT32GBObsoleteVFBGA3.3V4.41-40C to +85C

MTFC32GJWDQ-4M AIT Z32GBProductionLFBGA2.7V-3.6V4.5-40C to +85C

MTFC32GJWEF-4M AIT Z32GBProductionTFBGA2.7V-3.6V4.5-40C to +85C

MTFC32GJXED-WT32GBObsoleteVFBGA2.7V-3.6V-25C to +85C

MTFC32GLTDI-WT32GBObsoleteTFBGA2.7V-3.6V4.41-25C to +85C

MTFC32GLTDM-WT32GBObsoleteTFBGA2.7V-3.6V4.41-25C to +85C

MTFC32GLXDM-WT32GBObsoleteTFBGA2.7V-3.6V-25C to +85C

N2M400JDB341A3CE32GBObsoleteLBGA3.3V4.41-40C to +85C

N2M400JDB341A3CF32GBObsoleteLBGA3.3V4.41-40C to +85C

  • 64GB
Part No. (16)

MTFC4GACAAAM-1M WT4GBProductionVFBGA2.7V-3.6V4.5-25C to +85C

MTFC4GACAAAM-4M IT4GBEnd of LifeVFBGA2.7V-3.6V4.5-40C to +85C

MTFC4GACAANA-4M IT4GBProductionTBGA2.7V-3.6V4.5-40C to +85C

MTFC4GLGDM-AIT Z4GBProductionTFBGA2.7V-3.6V4.4-40C to +85C

MTFC4GLGDQ-AIT Z4GBProductionLBGA2.7V-3.6V4.4-40C to +85C

MTFC4GMTEA-WT4GBObsoleteWFBGA2.7V-3.6V4.41-25C to +85C

MTFC4GMWDM-3M AIT4GBProductionTFBGA2.7V-3.6V4.5-40C to +85C

MTFC4GMWDM-3M AIT A4GBProductionTFBGA2.7V-3.6V-40°C to +85°C

MTFC4GMWDQ-3M AIT4GBProductionLBGA2.7V-3.6V4.5-40C to +85C

MTFC4GMXEA-WT4GBObsoleteWFBGA2.7V-3.6V-25C to +85C

MTFC64GAJAEDQ-AIT64GBProductionLFBGA3.3V-40C to +85C

MTFC64GAKAEYF-4M IT64GBProductionLFBGA3.3V5.0-40C to +85C

MTFC64GJVDN-3M WT64GBObsoleteLFBGA3.3V4.41-25C to +85C

MTFC64GJVDN-4M IT64GBObsoleteLFBGA3.3V4.41-40C to +85C

N2M400KDA345K3BE64GBObsoleteLBGA3.3V-40C to +85C

N2M400KDA345K3BF64GBObsoleteLBGA3.3V-40C to +85C


  • 海力士eMMC
DensityProductNAND InformationPart numberPackage SizePackage Type
32GBUFS2.13D-V2 128GbH28U62301AMR11.5x13x1.0153ball FBGA
UFS2.13D-V3 128GbH28S6D302BMR11.5x13x1.0153ball FBGA
64GBUFS2.13D-V2 128GbH28U74301AMR11.5x13x1.0153ball FBGA
UFS2.13D-V3 128GbH28S7Q302BMR11.5x13x1.0153ball FBGA
128GBUFS2.13D-V2 128GbH28U88301AMR11.5x13x1.0153ball FBGA
UFS2.13D-V4 256GbH28S8Q302CMR11.5x13x1.0153ball FBGA
256GBUFS2.13D-V4 256GbH28S9O302BMR11.5x13x1.0153ball FBGA

UFS

东芝UFS

东芝存储器株式会社具有集成控制器的NAND闪存(NAND)能提供纠错、耗损均衡、坏块管理等功能。它们具有符合JEDEC/UFS版本2.1的接口,从而消除了用户对NAND特定控制的要求。

这简化了闪存存储在嵌入式应用中的集成。

容量器件型号UFS
版本
最大数据速率
(MB/s)
电源电压工作温度
(℃)
封装
VCC
(V)
VCCQ
(V)
VCCQ2
(V)
尺寸(mm)代码
32GBTHGAF8G8T23BAIL *2.111662.7至3.6(1)1.70至1.95-25至8511.5 x 13 x 0.8P-WFBGA153-1113-0.50
64GBTHGAF8G9T43BAIR *2.111662.7至3.6(1)1.70至1.95-25至8511.5 x 13 x 1.0P-VFBGA153-1113-0.50
128GBTHGAF8T0T43BAIR *2.111662.7至3.6(1)1.70至1.95-25至8511.5 x 13 x 1.0P-VFBGA153-1113-0.50
256GBTHGAF8T1T83BAIR *2.111662.7至3.6(1)1.70至1.95-25至8511.5 x 13 x 1.0P-VFBGA153-1113-0.50
  • 注解(1):该产品支持Vcc和VccQ2双电源操作。无需提供。
  • *新产品:请联系东芝存储器株式会社销售代表以获取新产品样品供应计划。

  • 三星eUFS

Product Selector

VersionDensityVoltageInterfacePackage SizeTemp.Product Status
UFS 2.11TB512GB256GB128GB64GB32GB1.8 / 3.3 VG3 2Lane11.5 x 13 x 1.72 mm11.5 x 13 x 1.4 mm11.5 x 13 x 1.2 mm11.5 x 13 x 1.0 mm-40 ~ 85 °C-40 ~ 105 °C-25 ~ 85 °CMass Production
Part NumberVersionDensityVoltageInterfacePackage SizeTemp.Product Status
KLUBG4G1ZF-B0CPUFS 2.132GB1.8 / 3.3 VG3 2Lane11.5 x 13 x 1.2 mm-40 ~ 85 °CMass Production
KLUBG4G1ZF-B0CQUFS 2.132GB1.8 / 3.3 VG3 2Lane11.5 x 13 x 1.2 mm-40 ~ 105 °CMass Production
KLUCG2K1EA-B0C1UFS 2.164GB1.8 / 3.3 VG3 2Lane11.5 x 13 x 1.0 mm-25 ~ 85 °CMass Production
KLUCG4J1ED-B0C1UFS 2.164GB1.8 / 3.3 VG3 2Lane11.5 x 13 x 1.0 mm-25 ~ 85 °CMass Production
KLUCG4J1ZD-B0CPUFS 2.164GB1.8 / 3.3 VG3 2Lane11.5 x 13 x 1.2 mm-40 ~ 85 °CMass Production
KLUDG4U1EA-B0C1UFS 2.1128GB1.8 / 3.3 VG3 2Lane11.5 x 13 x 1.0 mm-25 ~ 85 °CMass Production
KLUDG8J1ZD-B0CPUFS 2.1128GB1.8 / 3.3 VG3 2Lane11.5 x 13 x 1.2 mm-40 ~ 85 °CMass Production
KLUDG8J1ZD-B0CQUFS 2.1128GB1.8 / 3.3 VG3 2Lane11.5 x 13 x 1.2 mm-40 ~ 105 °CMass Production
KLUEG8U1EA-B0C1UFS 2.1256GB1.8 / 3.3 VG3 2Lane11.5 x 13 x 1.0 mm-25 ~ 85 °CMass Production
KLUEGAJ1ZD-B0CPUFS 2.1256GB1.8 / 3.3 VG3 2Lane11.5 x 13 x 1.72 mm-40 ~ 85 °CMass Production

海力士UFS

Key features of UFS 2.0

DensityProductNAND InformationPart numberPackage SizePackage Type
32GBUFS2.13D-V2 128GbH28U62301AMR11.5x13x1.0153ball FBGA
UFS2.13D-V3 128GbH28S6D302BMR11.5x13x1.0153ball FBGA
64GBUFS2.13D-V2 128GbH28U74301AMR11.5x13x1.0153ball FBGA
UFS2.13D-V3 128GbH28S7Q302BMR11.5x13x1.0153ball FBGA
128GBUFS2.13D-V2 128GbH28U88301AMR11.5x13x1.0153ball FBGA
UFS2.13D-V4 256GbH28S8Q302CMR11.5x13x1.0153ball FBGA
256GBUFS2.13D-V4 256GbH28S9O302BMR11.5x13x1.0153ball FBGA
  • UFS2.0 compatible
  • Operation Voltage Rage
    • – VCC (NAND): 2.7V ~ 3.6V
    • – VCCQ (CTRL): not used
    • – VCCQ2 (CTRL): 1.7V ~ 1.95V
  • Temperature
    • – Operation Temperature (-25℃ ~ 85℃ )
    • – Storage Temperature (-40℃ ~ 85℃ )
  • Supported features
    • – Erase / Discard / Purge / Wipe
    • – PWM G1-G5 / HS-G1-G3
    • – H@-G3 1L/2L
    • – Command Queuing / Cache
  • RPMB / Boot LU
  • Power-on / HW / Endpoint / LU Retest
  • BKOP
  • High Priority LU
  • Reliability Write Operation
  • Write Protect
  • Task Management Operation
  • Context ID, Data Tag
  • Secure Removal Type
  • Power Management Operations
  • UFS2.1 Device Health Descriptor
  • UFS2.1 Field Firmware Update

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