NAND FLASH/SPI NOR FLASH

NAND FLASH/SPI NOR FLASH

  • 东芝SLC NAND
类别容量
Raw SLC NAND 1Gb 2Gb 4Gb 8Gb16Gb32Gb*

*请点击任何一项以显示详细的产品信息并下载规格书。
*关于32Gb的信息,请联系销售代表。

  • 东芝SPI NAND

Serial Interface NAND

Features of Serial Interface NAND

Host can control the device by a low pin count

Supports Mode 0 and Mode 3 of Serial Peripheral Interface (SPI)Embedded ECC engine

Provides information of  ECC correction, ECC on Host controller is not required.The latest 24nm SLC NAND process technologyOffers wide line-up of capacity

For Serial Interface NAND, 1Gbit, 2Gbit and 4Gbit are available in a lineup.Available in small packages

6 x 8mm WSON, 10.3 x 7.5 SOP(*), 6 x 8 BGA(**)

* Please check the latest MP status with TMC sales representative regarding SOP package
** BGA package is under planning

Serial Interface NAND Block Diagram

 
* The ECC logic in Serial Interface NAND can be enabled and disabled by the customers.

Product Lineup

CategoryDensity
Serial Interface NAND1 Gb2 Gb4 Gb

*Please click on any item to show detailed product line up and to download datasheet


TONGCHIP 高性能工业级SPI NOR FLASH

  • 特性介绍:
  • TC25W**系列串口NOR FLASH为工业级产品
  • 高读写速度
  • 超宽工作电压:1.65V-3.7V
  • 页读取速度小于0.5ms
  • 读写次数10万次
  • 有限使用寿命达20年
  • 包装规范符合MSL3-MSL6
  • 封装材料复合GREEN标准

*目前量产产品为16Mbit,19年6月底推出8Mbit产品敬请期待


TONGCHIP 消费类SPI NOR TFLASH

  • 特性介绍:
  • TC25Q**系列串口NOR FLASH为消费级产品
  • 2 Line/4 Line两种规格
  • 标准工作电压:3.3V
  • 读写次数小于10万次
  • 有限使用寿命大于3年
  • 包装规范符合MSL1-3
  • 封装材料复合环保标准

*目前量产产品为2Mbit-128Mbit


*规格书请电邮索取:markte@tongchip.com

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